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Core technology of semiconductor sputtering target
The semiconductor industry is a high-tech industry with high technological thresholds and high output values. The output value of the global semiconductor industry this year is expected to reach 500 billion US dollars. Semiconductor manufacturing not only requires advanced lithography machines, but materials are also an important part of it, mainly including silicon wafers, photoresists, high-purity reagents, CMP materials, and sputtering targets.
High-purity metal sputtering targets mainly refer to metal targets with a purity of 99.9% -99.999%. They are used in the physical vapor deposition (PVD) process of electronic component manufacturing and are the key materials for the preparation of electronic thin films.
Sputtering is one of the main techniques for preparing thin-film materials. It uses the ions generated by the ion source to accumulate in a vacuum to form a high-speed energy ion beam, which bombards the solid surface, and the atoms on the solid surface leave the solid and are deposited on the substrate surface. The bombarded solid is the raw material for the thin film deposition by sputtering, which is called sputter coater target.
There are four main types of metal sputtering targets produced by Stanford Advanced Materials (SAM): aluminum, titanium, tantalum, and tungsten titanium targets. In addition, the company's other products include copper targets, nickel targets, cobalt targets, chromium targets, ceramic targets and other sputtering targets, as well as metal evaporation materials, carbon fiber composite parts for LCDs (mainly including carbon fiber support, carbon fiber drive shaft , Carbon fiber fork arm), etc. At the same time, the company sells tantalum targets (including tantalum rings) and titanium targets (including titanium rings) recovered from customers, and provides customers with cleaning and refurbishing services.
Here are 6 important facts about semiconductor wafers:
- Semiconductor is a solid substance whose conductivity is between insulator and metals, either due to the addition of an impurity or because of temperature effects. In other words, the conductivity of the semiconductor can be controlled by adding impurities as a specific amount of other materials to the semiconductor.
- Most semiconductor wafers are made of silicon, which is the second-most abundant element in the Earth's crust. In addition to silicon, semiconductors also use other materials, including germanium, gallium arsenide, germanium, indium phosphide, sapphire and quartz.
- Semiconductor wafers are available in a spread of diameters. The first semiconductor wafer made inside the US in 1960 was just 1 inch in diameter. Today, standard semiconductor wafers go up to 12 inches to 18 inches.
- Water is the key component of manufacturing silicon wafers. It is a compound that basically is a general solvent for all substances, silicon included. A large production facility uses up to 4.8 million gallons of water every day to supply Silicon wafers for manufacturing needs and supply.
- The thickness of semiconductor wafers varies greatly. The thickness of the wafer is always determined by the mechanical strength of any material used to make it. Regardless of what the semiconductor is made of, the wafer must be thick enough to support its own weight so that it does not break during processing.
- Contamination is inevitable during the manufacture and transportation of semiconductors. Appropriate storage conditions must be in place to prevent contamination and/or degradation after shipment. Semiconductor wafers that are not vacuum sealed must be placed in a Nitrogen (N2) cabinet at a flow rate of 2 to 6 SCFH (Standard Cubic Feet per Hour).
Post je objavljen 25.12.2019. u 06:30 sati.